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Products/Services

Semiconductor production

Wafer back-end processing

Bonding

Internal connections

Bumping systems

Bumping systems (2 exhibitors)

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TPT Wire Bonder GmbH & Co. KG

TPT Wire Bonder GmbH & Co. KG

85757 Karlsfeld, Germany

Wire Bonder and Die Bonder for development and production.

Main exhibitor

B2.308

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XTPL S.A.

XTPL S.A.

54-066 Wroclaw, Poland

Powering the microelectronics of tomorrow.

Main exhibitor

B2.119

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