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Infotech AG

IC-1200 Hybrid Bonder

BESI BE Semiconductor Industries N.V.

Smart Manufacturing

ANDA

High Speed Dispensing Machine

Zoller + Fröhlich GmbH

Processing of turned contacts

Axxon Europe B.V.

High-productivity, high-precision THT bonding system

Ersa GmbH & Co. KG

HR 600 P – high-precision automated rework

IBL-Löttechnik GmbH

Economy for small to medium series production

TRESTON Deutschland GmbH

Concept Ergo – ergonomic, modular, and ESD-safe

Mycronic AB

MY700 Jet printer and Dispenser

SCREEN SPE Germany GmbH

Wafer Pattern Inspection System ZI-3600

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