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BESI BE Semiconductor Industries N.V.

Smart Manufacturing

Infotech AG

IC-1200 Hybrid Bonder

Ersa GmbH & Co. KG

VERSAFLOW FIVE – redefinition of selective soldering

Axxon Europe B.V.

High-productivity, high-precision THT bonding system

MIVA Technologies GmbH

DART System

SCREEN SPE Germany GmbH

Wafer Pattern Inspection System ZI-3600

Salvia Group GmbH

Cleanroom & Facility Solutions

ELANTAS Europe GmbH

Conashield® CS 313 Flood Coating

OptiMel Schmelzgußtechnik GmbH

Low Pressure Moulding – electronics encapsulation

Ersa GmbH & Co. KG

VERSAFIT ONE – semi-automatic press-fit machine

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