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TECHNAX SAS

Combrazing : assembling technology for E-vehicles

INFICON

Transpector® APX Multi-Pressure

OptiMel Schmelzgußtechnik GmbH

Low Pressure Moulding – electronics encapsulation

Cencorp Automation Oy

World leading solutions for flexible through hole placement

VX Instruments GmbH

Dynamic High Power Semiconductor Testsystem DTS8765neo

RENA Technologies GmbH

Vanguard

Advanced Engineering Industrie Automation GmbH

PAL101-SPB: Peelmaster with intergrated Loader & Buffer

VX Instruments GmbH

Static High Power Semiconductor Testsystem STS8760neo

MIVA Technologies GmbH

DART System

Photonics Systems GmbH

Laser Drilling and Routing DR20X0

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