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Werner Lieb GmbH

Equipment Front End Modul (EFEM)

Siroco SA

AUTOMATION, CRIMPING AND MACHINIG

OptiMel Schmelzgußtechnik GmbH

Low Pressure Moulding – electronics encapsulation

Hubert Stüken GmbH & Co. KG

Stamping and stamping-bending - Plastic injection

Zoller + Fröhlich GmbH

Integrated solutions

MPK Kemmer DTECH GmbH

PCB Tools

VX Instruments GmbH

GT Studio Test Software

BESI BE Semiconductor Industries N.V.

Smart Manufacturing

Mycronic AB

MYPro™ I series 3D AOI

Solderstar

Selective optimization shuttle with Flux sensing

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