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Equipment and materials for Semiconductor Packaging and Assembly

Company profile

nanotec international provides solutions for semiconductor backend, assembly/packaging and related fields (automotive, medical etc.) to the European market.

Together with our strong partners, we can supply equipment and materials for various processes: Wafer Bonding (Bondtech), Flip Chip (Hanmi), Pressure Oven Curing (APT), Solder Ball Placing (Shibuya), Reflow (Sikama), Plasma Cleaning / Surface Activation (Vision Semicon), Dicing/Sawing&Placement (Hanmi), Laser Marking / Laser Cutting (Hanmi), Vision Inspection / AOI (INTEKPLUS), Void-Free Curing/Soldering (APT) and many more.

Our trained field service engineers, based all over Europe, are ready to assist on technical requests within a short time.