Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI
Technology, Inc. (AIT) has been one of the leading forces in the development of patented
applications of advanced material and adhesive solutions for electronic interconnection and
packaging.
. Our patented phase-change thermal pads, thermal greases and
gels, and thermal adhesives have also set many performance and dependability benchmarks for
power semiconductor and modules, computer, and communication electronics.