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Axxon Europe B.V.

High-productivity, high-precision THT bonding system

VX Instruments GmbH

Static High Power Semiconductor Testsystem STS8760neo

TEKON Prüftechnik GmbH

TEKONect 2.0

Siroco SA

AUTOMATION, CRIMPING AND MACHINIG

Dipl.-Ing. Wilhelm Schmidt GmbH Containers for critical fluids

High purity containers for microelectronics

TimeLine Business Solutions Group, Zentrale: Gebauer GmbH

TimeLine ERP - Electronics

Salvia Group GmbH

Process Automation

IBL-Löttechnik GmbH

IBL Premium Vapour Phase Soldering Systems BLC

Infotech AG

IC-1200 Hybrid Bonder

mta robotics AG

Advanced Automation for Precision Soldering Joints

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