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Infotech AG

IC-1200 Hybrid Bonder

MIVA Technologies GmbH

Direct Imager 2200L DI

OptiMel Schmelzgußtechnik GmbH

Low Pressure Moulding – electronics encapsulation

BUSCH Microsystems GmbH

Customized Positioning Systems

Kardex

Dynamic Storage & Retrival Systems

Teamster OÜ

Solder Pallets

OiTec Oy

OiTec Inline Testing Solution

Salvia Group GmbH

Turnkey Facility Construction

PIA Automation Amberg GmbH

Case Study PIA Inverter Assembly

Salvia Group GmbH

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