Assembly and packaging technology for microintegration (8 exhibitors)

all | A | B | F | I | P | T | X

all

A

B

F

I

P

T

X

A

AEMtec GmbH

12489 Berlin, Germany

Customized Microsystems and Optoelectronics

B

6921 RW Duiven, Netherlands

Discover Besi's ultimate Die Attach, Packaging and Plating solutions.

F

12681 Berlin, Germany

High-accuracy die bonder systems for R&D, prototyping and production.

I

4500 Solothurn, Switzerland

7177871 Modiin, Israel

Cutting Edge Electronics Additive Manufacturing at High-Speed & High-Resolution

P

63755 Alzenau, Germany

Your specialist for standard and special solutions for SMT and assembly

T

8800 Thalwil, Switzerland

Versatile & High Precision Die Bonder ... like a Swiss Army Knife

X

54-066 Wroclaw, Poland

Powering the microelectronics of tomorrow.