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BESI BE Semiconductor Industries N.V.

Smart Manufacturing

Mycronic AB

MYPro™ A40 component placement

BG INGENIERIE

BGi202 - USB Token personalization machine

Festo SE & Co. KG

ELGD

Ersa GmbH

POWERFLOW FIVE – Next-generation wave soldering

Werner Lieb GmbH

Equipment Front End Modul (EFEM)

PIA Automation Amberg GmbH

Case Study PIA Inverter Assembly

Ätztechnik Herz GmbH & Co. KG

Etch/laser technology - for example

Hubert Stüken GmbH & Co. KG

Stamping and stamping-bending - Plastic injection

Salvia Group GmbH

Process Automation

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