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Mikrodust AB

AtoMik® Dev Kit

OptiMel Schmelzgußtechnik GmbH

Low Pressure Moulding – electronics encapsulation

Kardex

High Availability & Picking Performance at Wipotec

Axxon Europe B.V.

High-productivity, high-precision THT bonding system

TEKON Prüftechnik GmbH

TEKONect 2.0

Starck Technology

Assembled PCB

Virginia Panel Corporation (VPC)

VPC Pull-Thru Solutions

RAMPF Production Systems GmbH & Co. KG

Automated sealing, casting, and bonding

Festo SE & Co. KG

VTUX

Teamster OÜ

Functional Testing Unit (FCT)

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