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MIVA Technologies GmbH

Direct Imager 2200L DI

OptiMel Schmelzgußtechnik GmbH

Low Pressure Moulding – electronics encapsulation

Mycronic AB

MYTower™- Component storage and flexible component feeders

BUSCH Microsystems GmbH

Customized Positioning Systems

ASSCON Systemtechnik-Elektronik GmbH

VP 2200-100

Photonics Systems GmbH

High-Speed Laser Depaneling Machine DP1010

Hubert Stüken GmbH & Co. KG

Deep Drawing out of Metal

Japan Unix Co., Ltd.

Robotic Soldering and Automation

TECHNAX SAS

Combrazing : assembling technology for E-vehicles

Ätztechnik Herz GmbH & Co. KG

Etch/laser technology - for example

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