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Axxon Europe B.V.

High-productivity, high-precision THT bonding system

Infotech AG

IC-1200 Hybrid Bonder

Ersa GmbH

HR 600 P – high-precision automated rework

Walter Lemmen GmbH

Automation technology in PCB production

OptiMel Schmelzgußtechnik GmbH

Low Pressure Moulding – electronics encapsulation

MIVA Technologies GmbH

Mask Writer 1200MW

INFICON

Transpector® APX Multi-Pressure

Cencorp Automation Oy

World leading solutions for flexible through hole placement

RENA Technologies GmbH

Vanguard

RAMPF Production Systems GmbH & Co. KG

Automated sealing, casting, and bonding

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