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OptiMel Schmelzgußtechnik GmbH

Low Pressure Moulding – electronics encapsulation

Herrmann Ultraschalltechnik GmbH & Co. KG

HiS SYSTEMS

Ersa GmbH & Co. KG

POWERFLOW FIVE – Next-generation wave soldering

FUJI EUROPE CORPORATION GmbH

NXTR - FUJI Smart Factory Platform

Global Management Logic AG

Smart mPERS Connected Cane Handle

TECHNAX SAS

Combrazing : assembling technology for E-vehicles

Test Research, Inc. (TRI)

TRI - Product Line and Advanced Applications

marco Systemanalyse und Entwicklung GmbH

Modular Precision Dispensing System from marco systems

VX Instruments GmbH

Static High Power Semiconductor Testsystem STS8760neo

Infotech AG

IC-1200 Hybrid Bonder

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