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Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. K&S has expanded its product offerings in advanced packaging through the acquisition of Assembléon, which diversifies K&S’ participation in the automotive and industrial markets via advanced SMT. K&S comprehensive solutions include ball bonding, wedge bonding, wafer level bonding, thermo-compression bonding, flip chip, FOWLP, WLP, SIP, PoP and Embedded Die. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor, LED devices and high quality printed circuit board assembly.