cyberTECHNOLOGIES is a leading provider of high-end metrology systems for semiconductor applications.

The portfolio ranges from compact systems for labs and process qualification to fully automated multi-sensor platforms with integrated material handling - built for accuracy, throughput, and continuous fab operation.

The systems are used worldwide by IDMs, foundries, and OSATs, in R&D to high-volume production for fast, reliable nano-resolution measurements across the process chain.

Application Examples:

• Wafer Warp, Bow
• Thickness & Variation (TTV / LTV)
• Thinfilm (down to 10 nm)
• Step Heights
• (µ-)Bumps, Pins, Pads & Pillars
• Laser groove
• Die Attach
• Chiplets
• Fillet Height
• 3D Wirebond
• Probecards (incl. Rework)
• Thermal Warpage
• Transparent Films & Coatings
• Thickfilm
• Roughness