High-End Performance Packaging from Wafer to System

Fraunhofer IZM is one of the world's leading institutions for applied research and development of robust and reliable electronics and their system integration. Together with partners from industry and science, its more than 450 employees are working to find technological solutions for future challenges: For example, for chiplet assembly, hybrid bonding, Si interposer technologies, fan-out wafer level packaging, cryo-packaging, the integration of high-bandwidth memories (HBMs), RF characterization, and packaging for 5G/6G applications. The institute provides its customers with customized system integration technologies at the wafer, chip, and board level.