F&S BONDTEC has been setting standards in wire bonding and testing for over 30 years.

As a global leader in the desktop equipment segment, we offer the most comprehensive portfolio of wire bonding and testing systems - developed and manufactured in Austria. Our modular platform combines all common wire bond processes and test methods into one future-proof Desktop Micro-Factory.

With innovations like BAMFIT for fast reliability testing and advanced image processing technology, our systems deliver unmatched precision, process control, and efficiency. Supported by a worldwide service network, we are your partner for quality and progress in semiconductor manufacturing.