JTA Equipment Technology
Tape/detape/wafer mount for semiconductor wafers, SiC wafer backgrind
Unternehmensprofil
Takatori tape/detape equipment, vacuum wafer mounting, taping inside wafer edge, for semiconductor wafers. Takatori wafer grind/backgrind for SiC wafer production.
Takatori wire saws for slicing of SIC ingots, plus slicing ceramics, glass, metals.
Gigamat CMP polish for SiC wafer production. Wafer metrology for SiC and Silicon wafers.
Anwendungsgebiete
Produkt- und Dienstleistungsangebot
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Mitaussteller
Kontaktdaten
JTA Equipment Technology
34 St Peters Wharf, Newcastle Upon Tyne NE6 1TW, Großbritannien
Kontaktanfrage