GTI Technologies Inc.
Vacuum lamination, tape removal, wafer mounting / SiC boule slice & SiC grind
Unternehmensprofil
GTI Technologies is a full-service distributor providing a range of Takatori single and multi-wire saws for slicing SiC ingots, ceramics, glass, graphite and other materials.
The GLP-SiC dedicated surface grinding platform supports SiC substrate manufacturing and wafer backgrind. To complete the SiC substrate manufacturing process, the offered Gigamat CMP systems support the critical preparation stage prior to SiC epitaxy.
In addition, GTI also supplies Takatori’s fully automated equipment solutions for vacuum lamination, tape removal and wafer mounting for semiconductor HVM and advanced packaging.
Our partnership with Loadpoint Ltd. also provides our customers with access to automated dicing platforms as well as associated spares and consumables.
SEMICON' EUROPA ID-number 5368.1.238
The GLP-SiC dedicated surface grinding platform supports SiC substrate manufacturing and wafer backgrind. To complete the SiC substrate manufacturing process, the offered Gigamat CMP systems support the critical preparation stage prior to SiC epitaxy.
In addition, GTI also supplies Takatori’s fully automated equipment solutions for vacuum lamination, tape removal and wafer mounting for semiconductor HVM and advanced packaging.
Our partnership with Loadpoint Ltd. also provides our customers with access to automated dicing platforms as well as associated spares and consumables.
SEMICON' EUROPA ID-number 5368.1.238
Anwendungsgebiete
Produkt- und Dienstleistungsangebot
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