Flip-chip bonders

Flip-chip bonders (4 exhibitors)

all | B | J | Q | T

all

B

J

Q

T

B

BESI BE Semiconductor Industries N.V.

6921 RW Duiven, Netherlands

Discover Besi's ultimate Die Attach, Packaging, Plating & Cleaning solutions.

J

91460 Marcoussis, France

Integrated solutions for assembly, nanomicroelectronics and optoelectronics.

Q

6331 Hünenberg, Switzerland

JEDEC Tray and Waffle Pack Feeder - Bonding Systems - Testsockets

T

16761 Hennigsdorf, Germany

Tresky is the leading DIE bonder manufacturer for the semiconductor industry.