Wafer back-end processing / Advanced Packaging (47 exhibitors)
all | A | B | D | F | G | H | K | L | M | O | P | Q | R | S | T | U | V | W | Y
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M
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A
78400 Bazainville, France
Volume measurement of droplets during in flight! Surface structuring with laser!
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B
16356 Werneuchen, Germany
Innovative ceramic heating elements for every application.
97990 Weikersheim, Germany
Innovative solutions for dispensing, impregnation, heat staking and plasma.
6921 RW Duiven, Netherlands
Discover Besi's ultimate Die Attach, Packaging, Plating & Cleaning solutions.
55450 Langenlonsheim, Germany
High-precision axis systems – tailored gantry solutions, XY stages, and more
D
72224 Ebhausen, Germany
Tailor-made low- and atmospheric pressure plasma, parylene and vacuum systems
F
14482 Potsdam, Germany
Up-to-date ultrasound technology for chip bonding and the semiconductor industry
5280 Braunau am Inn, Austria
Wire bonding expertise – Innovation from Braunau, shaping the future.
G
518125 Shenzhen, China
GREEN, national high-tech, focuses on auto assembly & semiconductor equipment.
72458 Albstadt, Germany
In the world of micro precision, we lead with innovation and latest technology.
H
21079 Hamburg, Germany
Resistance welding, quality assurance, micro welding, welding components
09247 Chemnitz-Röhrsdorf, Germany
Resistance welding, quality assurance, Micro welding, welding components