Wafer back-end processing / Advanced Packaging (62 exhibitors)
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A
90429 Nürnberg, Germany
Systems for electronic processing: LOW PRESSURE MOLDING / HOTMELT etc.
78400 Bazainville, France
Volume measurement of droplets during in flight! Surface structuring with laser!
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5708 HZ Helmond, Netherlands
Smart Fluid Dispensing Solutions for Tomorrow’s Electronics
B
16356 Werneuchen, Germany
Innovative ceramic heating elements for every application.
97990 Weikersheim, Germany
Innovative solutions for dispensing, impregnation, heat staking and plasma.
6921 RW Duiven, Netherlands
Discover Besi's ultimate Die Attach, Packaging, Plating & Cleaning solutions.
70469 Stuttgart, Germany
Industrialization Partner for Production Equipment in Electronics & Battery
55450 Langenlonsheim, Germany
High-precision axis systems – tailored gantry solutions, XY stages, and more
D
72224 Ebhausen, Germany
Tailor-made low- and atmospheric pressure plasma, parylene and vacuum systems
93345 Hausen, Germany
Intelligent dispensing solutions for industrial bonding and sealing processes.
E
85622 Feldkirchen, Germany
Excelitas® is a leading provider of advanced, life-enriching technologies
F
14482 Potsdam, Germany
Up-to-date ultrasound technology for chip bonding and the semiconductor industry