High-precision AOI&AXI Inspection Solutions for Advanced Semiconductor Packaging

Viscom is a leading provider of high-end inspection solutions for electronics and semiconductor manufacturing. With advanced X-ray (AXI) and optical inspection (AOI) systems, Viscom enables reliable quality control in advanced packaging. Applications cover ultra-fine structures such as bumps, balls, hybrid bonding and vias, as well as bond wires, surfaces and chip positioning. Customers benefit from submicron resolution, flexible system integration and powerful software for process security and traceability. As a German manufacturer with a global service network, Viscom combines technological excellence with decades of industrial expertise, supporting semiconductor manufacturers to achieve the highest levels of quality, reliability and efficiency in demanding production processes.