Established in 2001, Tokushima, rural Japan, YSystems' main business is the design and manufacturing of automated optical metrology instruments.

YSystems' main product is its non-contact optical property mapping systems "YWafer Mapper", with measurement capabilities that include photoluminescence, transmission, reflection, and surface curvature. It is applical to material and device wafer mapping from the deep ultraviolet to the infrared. 

Recent technology acquisitions however are showcased at this event, including mass production imaging based surface defects and impurity detection "YWafer Inspector" for SiC and GaN wafers up to 8 inch, and dicrete chip solder and epoxy bonding "YChip Bonder" for a wide range of applications from flip-chip LED bonding to transistor devices.