To build the intelligent future industry

QUICK, established in 1993, aims to be your global partner & your preferred destination for precision electronics assembly & backend semiconductor packaging solutions. In order to create value for our clients, we focus on our customers’ specific demands & application requirements, where reliability, high quality products, technical expertise, & application knowledge are important. Our reputation for excellence has been established through many years of successful business cases & equipment deployments. Products of noteworthy innovation include: multifunctional die bonder, eutectic die bonder, sintering, formic acid soldering, laser soldering, selective soldering, laser marking, 3D AOI & integrated automation solutions.