TOPLINE

Keyvisual von TOPLINE
 
Solder Columns CGA & BGA. DAISY CHAIN IC packages. Bonding Wire. JEDEC IC TRAY.

Unternehmensprofil

SOLDER COLUMNS are more reliable than solder balls for SPACE and DEFENSE IC packages.Non Collapsible. Absorbs CTE Mismatch for reliable IC packages. 

Hauptaussteller

Kontaktdaten

TOPLINE
95 Highway 22 W, Milledgeville, GA 31061, USA
Kontaktanfrage
Kontakt Vertrieb
JARED WILSON
DIRECTOR SALES
TOPLINE
Kontakt Vertrieb
JENS HOEFER
Managing Director
FACTRONIX GmbH