Assembly and packaging technology for microintegration (4 exhibitors)

all | A | B | F | T
all
A
B
F
T
A
Logo of AEMtec GmbH
12489 Berlin, Germany
Customized Microsystems and Optoelectronics
B
Logo of BESI BE Semiconductor Industries N.V.
6921 RW Duiven, Netherlands
Discover Besi's ultimate Die Attach, Packaging, Plating & Cleaning solutions.
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F
12681 Berlin, Germany
High-accuracy die bonder systems for R&D, prototyping and production.
T
Logo of Dr. Tresky AG
8800 Thalwil, Switzerland
Versatile & High Precision Die Bonder ... like a Swiss Army Knife