T-Micro is the unique and advanced 3D/2.5D IC process-oriented foundry with chip level to 12"wafer level integration.  

Three-dimensional LSI is a technology to chipletize SoCs and connect chiplets with many short wires to achieve high speed and high performance.  Since our establishment, we have developed the necessary elemental technologies for 3D integration in-house.  These include TSVs of various sizes and structures, various micro bumps, wafer thinning, and bonding, molding, heterogeneous stacking etc.  We hope to combine these elemental technologies to create new high-performance devices together with you.