PacTech - Packaging Technologies GmbH
Pioneer in Laser Soldering & Laser Assisted Bonding
Company profile
PacTech, established 1995 and a group company of NAGASE & CO., LTD., manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level bumping & packaging contract manufacturing. The equipment product line consists of solder jetting equipment, wafer-level solder ball transfer systems, laser assisted bonders (LAB, LCB, LAR) and wet chemical lines for high volume electroless plating.
The wafer level packaging & bumping subcontractor services consist of electroless Under Bump Metallization for either wafer level solder bumping for Flip Chip or WLCSP or for wire bonding. Additionally, PacTech offers AOI, X-Ray, SEM, FIB, wafer-level redistribution, wafer backside metallization, wafer thinning, laser backside marking and wafer dicing.
The wafer level packaging & bumping subcontractor services consist of electroless Under Bump Metallization for either wafer level solder bumping for Flip Chip or WLCSP or for wire bonding. Additionally, PacTech offers AOI, X-Ray, SEM, FIB, wafer-level redistribution, wafer backside metallization, wafer thinning, laser backside marking and wafer dicing.
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PacTech - Packaging Technologies GmbH
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