PLACE-N-BOND™ Underfilm: Hot melt adhesive for SMD mechanical reliability

Alltemated manufactures the leading underfill alternative, PLACE-N-BOND™ underfilm, a hot melt adhesive. pb tec solutions, located in Germany, is our distributor. Together, we improve applications by eliminating the secondary process of dispensing and curing underfill. Packaged in tape and reel, the underfilm integrates seamlessly with SMT assembly lines. It is picked and placed alongside components, goes through reflow, and that’s it! Originally designed for corner/edge bonding of BGA/LGA/CSP devices to prevent solder ball failure, its uses now include double-sided reflow part retention, flex to rigid strain relief or hot bar, and damming. Being thermoplastic, it is 100% reworkable. Tested and proven on lead-free solders and assembly processes. No extra equipment or maintenance required.