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Solder Paste for die-bonding and heat sink joining
Solder Paste for die-bonding and heat sink joining

Solder Paste for die-bonding and heat sink joining, an Ultimate Alternative to pre-forms and solder pastes that require cleaning!

KOKI, a manufacturer and supplier of high quality soldering materials worldwide, introduces the latest and innovative solder paste, E12 series, meant for power devices application, such as MOSFET and IGBT.

Pre-forms are commonly use for soldering power devices. And in some and certain occasions, conventional solder pastes are used for the same purpose. Both methods have their own drawbacks in terms of production efficiency and production cost.

Using E12 series can provide the following advantages over the conventional methods;

- Super low void, extremely low residue
E12 series are designed to be low voiding, comparable with pre-form
Remaining flux residue is so low that cleaning  may be eliminated

- Drastic reduction in production cost
Eliminate the need for using costly pre-form
Solder paste can be applied at once by printing
Cleaning process cost can be saved

- Various alloy types available
SAC305, Sn5Sb, Sn3Ag8Sb, and many more upon request

E12 series solder pastes are  designed for Oxidation Reduction Vacuum Reflow Process.

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