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Axxon Europe B.V.

High-productivity, high-precision THT bonding system

Mycronic AB

MYPro™ A40 component placement

VX Instruments GmbH

Static High Power Semiconductor Testsystem STS8760neo

Starck Technology

Assembled PCB

JUKI Automation Systems GmbH

Four disciplines – one goal

Micro Control Company

The Future of Burn-In

Mycronic AB

MYTower™- Component storage and flexible component feeders

marco Systemanalyse und Entwicklung GmbH

Modular Precision Dispensing System from marco systems

Werner Lieb GmbH

Equipment Front End Modul (EFEM)

ViscoTec Pumpen- u. Dosiertechnik GmbH

Emptying System vipro-FEED

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