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Werner Lieb GmbH

Equipment Front End Modul (EFEM)

RAMPF Production Systems GmbH & Co. KG

Automated sealing, casting, and bonding

VX Instruments GmbH

Static High Power Semiconductor Testsystem STS8760neo

Festo SE & Co. KG

ELGD

Solderstar

Selective optimization shuttle with Flux sensing

RÖSNICK GmbH

PRODUCT SPECIFIC SOLDERING SYSTEMS

BESI BE Semiconductor Industries N.V.

Smart Manufacturing

Virginia Panel Corporation (VPC)

VPC G12

OptiMel Schmelzgußtechnik GmbH

Low Pressure Moulding – electronics encapsulation

ViscoTec Pumpen- u. Dosiertechnik GmbH

Emptying System vipro-FEED

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