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Advanced Taping/detaping/mounting equipment for semiconductor wafers

Company profile

Takatori tape and detape equipment, vacuum wafer mounting, inner cut taping, for Semiconductor wafers.

Takatori Wafer grinding for SiC wafer production

Takatori wire saws for SiC ingot slicing, plus ceramics, metals, glass

Gigamat CMP polish for SiC wafer production.  Wafer metrology for SiC and Silicon wafers

Logomatic Ingot OD grinder for SiC production