Exhibitor portal
JTA Equipment Technology
Advanced Taping/detaping/mounting equipment for semiconductor wafers
Company profile
Takatori tape and detape equipment, vacuum wafer mounting, inner cut taping, for Semiconductor wafers.
Takatori Wafer grinding for SiC wafer production
Takatori wire saws for SiC ingot slicing, plus ceramics, metals, glass
Gigamat CMP polish for SiC wafer production. Wafer metrology for SiC and Silicon wafers
Logomatic Ingot OD grinder for SiC production
Products and services
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Co-Exhibitors
Contact
JTA Equipment Technology
34 St Peters Wharf, Newcastle upon Tyne NE6 1TW, Great Britain
Contact request