Ausstellerportal
JTA Equipment Technology
Advanced Taping/detaping/mounting equipment for semiconductor wafers
Unternehmensprofil
Takatori tape and detape equipment, vacuum wafer mounting, inner cut taping, for Semiconductor wafers.
Takatori Wafer grinding for SiC wafer production
Takatori wire saws for SiC ingot slicing, plus ceramics, metals, glass
Gigamat CMP polish for SiC wafer production. Wafer metrology for SiC and Silicon wafers
Logomatic Ingot OD grinder for SiC production
Anwendungsgebiete
Produkt- und Dienstleistungsangebot
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Mitaussteller
Kontaktdaten
JTA Equipment Technology
34 St Peters Wharf, Newcastle upon Tyne NE6 1TW, Großbritannien
Kontaktanfrage