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JTA Equipment Technology

SEMICON Europa
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Advanced Taping/detaping/mounting equipment for semiconductor wafers

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Takatori tape and detape equipment, vacuum wafer mounting, inner cut taping, for Semiconductor wafers.

Takatori Wafer grinding for SiC wafer production

Takatori wire saws for SiC ingot slicing, plus ceramics, metals, glass

Gigamat CMP polish for SiC wafer production.  Wafer metrology for SiC and Silicon wafers

Logomatic Ingot OD grinder for SiC production

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JTA Equipment Technology
34 St Peters Wharf, Newcastle upon Tyne NE6 1TW, Großbritannien
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