Mobile Navigation
We are worldwide leading institute for microelectronic wafer level packaging.


Fraunhofer IZMs center "All Silicon System Integration Center Dresden - ASSID" was established in 2010 and is integral part of Fraunhofer IZMs wafer level system packaging and system integration. Fraunhofer IZM-ASSID operates a state-of-the-art 300mm process line for 3D wafer level system integration based on Cu-Trough Silicon Via (CU-TSV) technology. Constituent parts of the line are individual process modules for TSV formation, for TVS post-processing as well as assembly and 3D stacking. The process line allows an application-oriented development of 3D wafer level processes as well as the qualification and prototype manufacturing for 3D wafer level system in packages, CSP, e.g.