Founded in 1975, based in France, SET is a world leading supplier of High Accuracy Flip-Chip Bonders (chip-to-chip and chip-to-wafer) and versatile Nanoimprint Lithography (NIL) solutions.

With equipment installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its Flip-Chip Bonders.

Ranging from manual loading to fully automated version, the SET Flip-Chip Bonders adapt to all main bonding techniques: fluxless reflow, thermo-compression, adhesive joining compression, thermosonic…

SET offers a comprehensive product portfolio of Flip-Chip Bonders for fast growing markets and serving clients through a global network of representatives and in-depth customer trainings.

Visit SET website for more information: www.set-sas.fr