KOKI Company Limited is proud to announce its participation in productronica 2019, to be held from 12th to 15th of November at Messe München, Munich, Germany.
On exhibit are new halogen-free high-performance solder pastes with a variety of features such as high reliability, superior ICT testability, and excellent cleanability.
Also included are conventional halogen containing, yet highly advanced solder pastes specialized for powerful wetting and low voiding.
For power device application, leaded alloy and a new lineup for dispensing application will be introduced, adding to the current alloy variation and printing application.
Visit our booth and find out more details and in person about our new products at productronica!