LEITERPLATTENLOHNGALVANIK Verfahren: Desmear, Plasma ToPI, Durchkontaktieren, Kupferaufbau, Microfill, Leiterbildaufbau, Galv. Ni/Au, ENIG, Chem. Zinn, OSP, Chem. Silber, reel to reel, ENEPIG, chem. Ni/Pd/Au, ISIG, EPIG, Through hole filling (THF), Advanced via filling
JOB PLATING FOR PCB Processes: Desmear, Plasma ToPI, PTH, Pattern Plating, Panel Plating, Microfill, Electrolytical Ni/Au, ENIG, Immersion Tin, OSP, Immersion Silver, reel to reel, ENEPIG, chem. Ni/Pd/Au, ISIG, EPIG, Through hole filling (THF), Advanced via filling