Pac Tech - Packaging Technologies GmbH - Exhibitor details - productronica exhibitor directory

Pac Tech - Packaging Technologies GmbH

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Company profile

PacTech – Packaging Technologies GmbH is a provider of advanced wafer plating, packaging & solder ball placement equipment. As an innovator of Laser Assisted Solder Jetting & Laser Chip Bonding, PacTech provides solder bonding solutions for semiconductors & additional electronic components, alongside with its turnkey solution for wafer level e-less plating including process, equipment & chemical supplies.

Additionally, PacTech offerssubcontracting services for high volume production & engineering projects on wafer, substrate and chip level out of all PacTech sites

PacTech provides a broad range technology solutions e-less Ni/Au for Flip Chip or WLCSP, e-less Ni/Pd/Au or Ni/Pd UBM OPM for Au or Cu wire bonding, electroplated Cu Pillars, solder balling and many more other back-end services.

Product and service range

Applications

Am Schlangenhorst 7-9
14641 Nauen
Germany
P  +49 3321 4495-100
F  +49 3321 4495-124

Hall / Booth

plan of the exhibition center
Hall A6
Hall B0
Hall B4
Hall B5
Hall B6
Hall C1
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Hall C4
Entrance West
Entrance North
Entrance East
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Hall Entry Middle
Hall Entry South
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Open-Air Site
Hit(s) in this hall
CONTACT SALES
Mr. Thomas Oppert
P  +49 3321 4495620
CONTACT PR
Ms. Ulrike Schmidt
P  +49 3321 4495122
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