Equipment for many processes in SMT, PCB assembly, Semiconductor packaging & other electronics manufacturing will be demonstrated by eight divisions of Nordson. Our technologies provide innovative solutions to give customers more control of their operations to produce more reliable products.
Test & Inspection (stand A2.445)
• Acoustic Micro Imaging systems (AMI): Nordson SONOSCAN
• Automated Optical Inspection (AOI): Nordson YESTECH
• Automated X-Ray (AXI): Nordson MATRIX
• Automated counting systems utilizing x-ray technology: Optical Control, now part of Nordson DAGE
• Bond Testing: Nordson DAGE
• Manual X-Ray Inspection (MXI): Nordson DAGE
• Materials Testing: Nordson DAGE
Production Technologies (A2.345)
• Automated Fluid Dispensing: Nordson ASYMTEK
• Conformal Coating & Curing: Nordson ASYMTEK
• Hot Bar Soldering & Heat-Seal Bonding, ACF Laminate: Nordson DIMA
• Plasma Cleaning & Surface Treatment: Nordson MARCH
• Selective Soldering: Nordson SELECT
Nordson equipment is backed by an award-winning global network of service and applications support.