AI Technology, Inc. - Exhibitor details - productronica exhibitor directory

AI Technology, Inc.

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Company profile

Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AIT has been one of the leading forces in the development of advanced material and adhesive solutions including: Insulated Metal Substrates, Gap-Filling Compressible Phase-Change Pads, Thermal Gels, Thermal Grease, Stress-free Adhesive Films, Adhesive Pastes, RF/EMI shielding solutions, and Copper-Clad Laminates. AI Technology’s ISO9001:2000 certified facility produces an extensive line of adhesive materials that include: Conductive and Dielectric materials, high operating temperature adhesive solutions, room temperature cure materials, solvent free material, Z-Axis conductive material along with Mil Std 883; Method 5011.5 testing and NASA/ESA ASTM E 595 Outgassing qualified and are ITAR controlled

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plan of the exhibition center
Hall A6
Hall B0
Hall B4
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Hall B6
Hall C1
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Entrance West
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Hall Entry North
Hall Entry Middle
Hall Entry South
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