SST Vacuum Reflow Systems - Exhibitor details - productronica exhibitor directory

Exhibitor details

9801 Everest Street
Downey, CA 90242
USA
P   +1 562 8033361
F   +1 562 8034043

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Hall overview

plan of the exhibition center
Hall A6
Hall B0
Hall B4
Hall B5
Hall B6
Hall C1
Hall C2
Hall C3
Hall C4
Entrance West
Entrance North
Entrance East
Atrium
Atrium
Atrium
Atrium
Stairs
Stairs
Stairs
Stairs
Stairs
Hall Entry North
Hall Entry Middle
Hall Entry South
Hall Connection
Hall Connection
Hall Connection
Hall Connection
Hall Connection
Hall Connection
Hall Connection
Hall Connection
Hall Connection
Hall Connection
Hall Connection
Hall Connection
Hall Connection
Hall Connection
Hall Connection
Hall Connection
Hall Connection
Open-Air Site
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Exhibitor Information

SST Vacuum Reflow Systems solves complex high reliability packaging challenges. Using precision recipes of heat, vacuum, weight and pressure, our US built systems create void free, flux free solder joints for complex die attach/hermetic seal applications. SST uses semiconductor grade graphite tooling to provide strength, precision, and durability in the die attach/hermetic seal processes. Our Process Development engineers, help customers quickly achieve desired results and maximize their return on investment.

Product and service range

Partner companies

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