Innovations in dual-lane manufacturing boost throughput and flexibility

Among the most important markets for today’s electronics manufacturers, IoT (Internet of Things) applications and automotive electrification are characterised by increasing demand for large numbers of a wide range of electronic device types.

According to ResearchGate, already more than 50 billion IoT devices such as smart home monitors, wearables, and industrial sensors are connected to the internet, with over 10 billion more added every year.

In automotive, the pace of electrification continues to accelerate, to improve economy, lower emissions, increase safety, and enhance driver and passenger experiences. Increasingly sophisticated infotainment and driver-monitoring systems, advanced driver-assistance systems (ADAS), electronically controlled lighting, and electric propulsion mean emerging new models contain literally hundreds of circuit boards populated with processors, communication ICs, power semiconductors, high-power LED arrays, and more.

The number and diversity of these technologically advanced devices, embedded in our digital lifestyles, is disrupting the traditional division in electronic manufacturing between high-mix/low-volume and low-mix/high-volume. OEM and EMS businesses need to produce a high mix of different product types in high volumes, and must maintain high productivity at all times.

Dual-Lane SMT

Dual-lane surface-mount assembly equipment appears to offer a solution by allowing simultaneous assembly of PCBs in each lane. This helps manufacturers respond to fast-growing markets in several ways.