Hanover, Germany, October 18, 2023 – At productronica in Munich, Germany, taking place from November 14 to 17, 2023, Viscom AG will present for the first time its latest high-end iS6059 Double-Sided Inspection system. At Viscom's Booth A2.177, visitors to the world’s leading trade fair for electronics manufacturing can learn more about the advantages of simultaneous optical assembly inspection from above and below using the new machine’s special features.
The iS6059 Double-Sided Inspection is equipped with two state-of-the-art sensor heads that capture images and 3D height information on separate positioning units to reliably find top and bottom side defects. Through-hole technology (THT) is still needed and used in the areas of electric vehicles, charging infrastructures and renewable energies due to high current flows. In addition to inspecting components topside, the bottom side must also be critically examined to determine whether a pin is missing or if there is insufficient solder. Components pressed in without soldering (press-fit) can also be accurately inspected. Pin lengths, for example, are precisely measured and displayed in profiles.