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Automated Inspection/Metrology - Semiconductor/Micro-electronics/Packaging/SMT

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AOI Solutions for Microelectronics and Packaging

No other AOI Solutions provider can match MVP’s extensive range of metrology based applications from Microelectronics to SMT across diverse industries such as Commercial, Medical, Defense and Automotive.

MVP has an extensive knowledge of diverse processes and provides multiple AOI solutions for Die, Wire Bond, Epoxy Lead Frame, Wafer and BGA Inspection. 

Material handling options include MVP Integrated Magazine Handlers for lead frames and wafers and support for Auer Boats, BGA, Jedec and Waffle Trays. MVP work with their customers on custom material handling solutions where required.

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