TDM by Insidix offers state of the art deformation and warpage measurement system while devices under evaluation are experiencing thermal stress. The technology uses phase shifting Projection Moiré, advanced 3D sensors, and temperature chambers that can apply temperatures between -65°C to 400°C to the DUT.

The systems are ideal for research development, quality and reliability, process development, and failure analysis studies. Present in semiconductor, medical, automotive, aerospace, and electronics industries.